Browsing by Subject "bonding"

High accuracy bonding of optical components is required for the manufacture of photonic integrated circuits. We propose and demonstrate a novel method of metal-to-metal thermocompression bonding. By using highly localized heating, we propose to avoid thermal drift during bonding and stresses due to thermal mismatch of bonded components. This is achieved by focusing an infrared laser through a silicon substrate and a purpose built thin film stack to heat the bonding interface. Samples with gold bonding pads are used to investigate bonding efficacy. We demonstrate melting of metal bonding pads. Shear testing suggests that the limiting factor in attained bond strength is the structure of the thin film stack under the bonding pad. A redesign of this stack is required in order to improve bond durability.